les certifications
Standard:
ISO9001
Nombre:
CNQMS047967
date d'émission:
2021-06-21
date d'expiration:
2024-06-21
champ d'application / portée:
Design and Manufacturing of Bonding Wire (Silver Based, Copper Based Wires) for Semiconductor Packaging
Délivré par:
NSFInternational Strategic Registrations
Standard:
IATF 16949:2016
Nombre:
0406197
date d'émission:
2021-06-21
date d'expiration:
2024-06-21
champ d'application / portée:
Design and Manufacturing of Bonding Wire (Silver Based, Copper Based Wires) for Semiconductor Packaging
Délivré par:
NSFInternational Strategic Registrations
Standard:
GB/T24001-2016/IS014001:2015
Nombre:
2052022E00126R2M
date d'émission:
2022-07-25
date d'expiration:
2026-07-24
champ d'application / portée:
Design and Manufacturing of Bonding Wire (Silver Based, Copper Based Wires) for Semiconductor Packaging
Délivré par:
IAF and CNAS
Standard:
Integration of Informatizafion and Industrialization Management System Certificate
Nombre:
AIITRE-00123IIIMS0470801
date d'émission:
2023-05-26
date d'expiration:
2026-05-25
champ d'application / portée:
Design and Manufacturing of Bonding Wire (Silver Based, Copper Based Wires) for Semiconductor Packaging
Délivré par:
CEPREI
Standard:
GJB 9001C-2017
Nombre:
02623J31381R0M
date d'émission:
2023-06-27
date d'expiration:
2026-06-26
champ d'application / portée:
Design and Manufacturing of Bonding Wire (Silver Based, Copper Based Wires) for Semiconductor Packaging
Délivré par:
BTCC-GJB
Profil de la société
SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
Contact: MsJiang
